Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling. - Fei Su; Ronghai Mao; Xiaoyan Wang; Guangzhou Wang; Haiyan Pan (Microelectron. Reliab., 2011)

On thermo-mechanical reliability of plated-through-hole (PTH). - Fei Su; Ronghai Mao; Ji Xiong; Kun Zhou; Zheng Zhang; Jiang Shao; Cunyi Xie (Microelectron. Reliab., 2012)