Modeling of substrate contacts in TSV-based 3D ICs. - Masayuki Watanabe; Masa-Aki Fukase; Masashi Imai; Nanako Niioka; Tetsuya Kobayashi; Rosely Karel; Atsushi Kurokawa (3DIC, 2014)

Impact of on-chip interconnects on vertical signal propagation in 3D ICs. - Nanako Niioka; Masayuki Watanabe; Rosely Karel; Tetsuya Kobayashi; Masashi Imai; Masa-Aki Fukase; Atsushi Kurokawa (APCCAS, 2014)

Effect of substrate contacts on reducing crosstalk noise between TSVs. - Masayuki Watanabe; Rosely Karel; Nanako Niioka; Tetsuya Kobayashi; Masa-Aki Fukase; Masashi Imai; Atsushi Kurokawa (APCCAS, 2014)

An effective model for evaluating vertical propagation delay in TSV-based 3-D ICs. - Masayuki Watanabe; Nanako Niioka; Tetsuya Kobayashi; Rosely Karel; Masa-Aki Fukase; Masashi Imai; Atsushi Kurokawa (ISQED, 2015)