Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology. - Rahul Mathur; Chien-Ju Chao; Rossana Liu; Nikhil Tadepalli; Pranavi Chandupatla; Shawn Hung; Xiaoqing Xu; Saurabh Sinha; Jaydeep Kulkarni (CoRR, 2020)

Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. - Lingjun Zhu; Tuan Ta; Rossana Liu; Rahul Mathur; Xiaoqing Xu; Shidhartha Das; Ankit Kaul; Alejandro Rico; Doug Joseph; Brian Cline; Sung Kyu Lim (ISLPED, 2021)