Impact of back side circuit edit on active device performance in bulk silicon ICs. - Uwe Kerst; Rudolf Schlangen; A. Kabakow; Erwan Le Roy; Ted R. Lundquist; Siegfried Pauthner (ITC, 2005)

Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. - Rudolf Schlangen; Uwe Kerst; A. Kabakow; Christian Boit (Microelectron. Reliab., 2005)

Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node. - Rudolf Schlangen; Peter Sadewater; Uwe Kerst; Christian Boit (Microelectron. Reliab., 2006)

Backside E-Beam Probing on Nano scale devices. - Rudolf Schlangen; Reiner Leihkauf; Uwe Kerst; Christian Boit; Rajesh Jain; Tahir Malik; Keneth R. Wilsher; Ted R. Lundquist; Bernd Krüger (ITC, 2007)

Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. - Rudolf Schlangen; Uwe Kerst; Christian Boit; Tahir Malik; Rajesh Jain; Ted R. Lundquist (Microelectron. Reliab., 2007)

Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. - Christian Boit; Rudolf Schlangen; Uwe Kerst; Ted R. Lundquist (IEEE Des. Test Comput., 2008)

Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. - Rudolf Schlangen; Reiner Leihkauf; Uwe Kerst; Ted R. Lundquist; Peter Egger; Christian Boit (Microelectron. Reliab., 2009)

Dynamic lock-in thermography for operation mode-dependent thermally active fault localization. - Rudolf Schlangen; Hervé Deslandes; Ted R. Lundquist; C. Schmidt; Frank Altmann; K. Yu; A. Andreasyan; S. Li (Microelectron. Reliab., 2010)

Focused ion beam contact to non-volatile memory cells. - Clemens Helfmeier; Rudolf Schlangen; Christian Boit (Microelectron. Reliab., 2014)