A 3D micro-channel cooling system embedded in LTCC packaging substrate. - Songtao Jia; Min Miao; Runiu Fang; Shichao Guo; Duwei Hu; Yufeng Jin (NEMS, 2012)

In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. - Yichao Xu; Guanjiang Wang; Xin Sun 003; Runiu Fang; Min Miao; Yufeng Jin (NEMS, 2013)