Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges. - Peng Gu; Shuangchen Li; Dylan C. Stow; Russell Barnes; Liu Liu 017; Yuan Xie 001; Eren Kursun (ACM Great Lakes Symposium on VLSI, 2016)

Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5D/3D integration. - Dylan C. Stow; Itir Akgun; Russell Barnes; Peng Gu; Yuan Xie 001 (ICCAD, 2016)

Thermal-aware 3D design for side-channel information leakage. - Peng Gu; Dylan C. Stow; Russell Barnes; Eren Kursun; Yuan Xie 001 (ICCD, 2016)

Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space. - Dylan C. Stow; Itir Akgun; Russell Barnes; Peng Gu; Yuan Xie 001 (ISVLSI, 2016)

Architectural evaluations on TSV redundancy for reliability enhancement. - Yen-Hao Chen; Chien-Pang Chiu; Russell Barnes; TingTing Hwang (DATE, 2017)

Thermal-Aware 3D Design for Side-Channel Information Leakage. - Dylan C. Stow; Russell Barnes; Eren Kurshan; Yuan Xie 001 (CoRR, 2025)