The physical mechanism investigation of off-state drain bias TDDB and its implication in advance HK/MG FinFETs. - I. K. Chen; S. C. Chen; S. Mukhopadhyay; D. S. Huang; J. H. Lee; Y. S. Tsai; Ryan Lu; Jun He (IRPS, 2018)

Comprehensive device and product level reliability studies on advanced CMOS technologies featuring 7nm high-k metal gate FinFET transistors. - D. S. Huang; J. H. Lee; Y. S. Tsai; Y. F. Wang; Y. S. Huang; C. K. Lin; Ryan Lu; Jun He (IRPS, 2018)

A Novel Constant E-Field Methodology for Intrinsic TDDB Lifetime Projection. - A. S. Teng; C. W. Lin; M. N. Chang; Aaron Wang; Ryan Lu (IRPS, 2019)

Protection Schemes for Plasma Induced Damage from Well-Side Antennas. - Hsi-Yu Kuo; Yu-Lin Chu; Hung-Da Dai; Chun-Chi Wang; Pei-Jung Lin; Ethan Guo; Yu-Ti Su; Chia-Lin Hsu; Kuan-Hung Chen; Tsung-Yuan Chen; Ryan Lu; Victor Liang; et al. (IRPS, 2023)

Reliability Challenges from 2.5D to 3DIC in Advanced Package Development. - Ryan Lu; Yao-Chun Chuang; Jyun-Lin Wu; Jun He (IRPS, 2023)

Layout Guidelines against Charging Damage from the Well-Side Antennas in Separated Power Domains. - Hsi-Yu Kuo; Yu-Lin Chu; Hung-Da Dai; Chun-Chi Wang; Pei-Jung Lin; Shu-Cheng Kuo; Ethan Guo; Ya-Min Zhang; Yu-Ti Su; Chia-Lin Hsu; Kuan-Hung Chen; Tsung-Yuan Chen; et al. (IRPS, 2024)

Electromigration Performance of Cu Bumps in Various Configurations. - Jui-Shen Chang; Chung-Yu Chiu; Ching-Ting Liu; Chen-Nan Chiu; Yao-Chun Chuang; Ryan Lu (IRPS, 2025)

Refined High Resistance Baking Approaches for Optimal Interconnect Reliability. - H. C. Chang; Eliot Chen; P. J. Liao; J. H. Lee; Ryan Lu; Y. K. Hwang (IRPS, 2025)

Exploring AC Time-Dependent Dielectric Breakdown (TDDB) Through Frequency Noise Analysis. - Y. K. Chang; P. J. Liao; Y. C. Chang; C. H. Chou; Y. S. Liu; J. H. Lee; Ryan Lu; Y. K. Hwang (IRPS, 2025)

Characterization of Cu and SiCN Adhesion in BEOL Interconnections. - Chang-Fu Han; Jia-Ming Yang; Chia-Hua Chang; Yu-Sheng Lin; Jyun-Lin Wu; Yao-Chun Chuang; Ryan Lu (IRPS, 2025)

Comprehensive Study of Non-Conducting Stress Characteristics in Ultra-Scaled FinFET. - Jun-Yu Huang; Clement Huang; Kun-Chung Huang; Da-You Yang; Hsin-Jou Chuang; Yi-Wen Lee; Eliot Chen; Jen-Hao Lee; Ryan Lu (IRPS, 2025)

Well-Charging Damage to Capacitors Connected Between VDD and VSS in a Single Power Domain. - Hsi-Yu Kuo; Yu-Lin Chu; Chien-Jen Wang; Steven Sze Hang Poon; Chun-Wei Yao; Hsuan Chu; Yi-Ching Chen; Yi-Lun Chen; Yu-Ti Su; Chia-Lin Hsu; Tsung-Yuan Chen; Te-Liang Li; et al. (IRPS, 2025)

CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives. - Ching-Ting Liu; Yao-Chun Chuang; Jyun-Lin Wu; Jia-Shen Lan; Chang-Fu Han; Chia-Hua Chang; Jia-Ming Yang; Yu-Sheng Lin; Chen-Wei Li; Ryan Lu (IRPS, 2025)