Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air. - Ryo Takigawa; Eiji Higurashi; Tadatomo Suga; Satoshi Shinada; Tetsuya Kawanishi (IEICE Trans. Electron., 2007)

High-speed via hole filling using electrophoresis of Ag nanoparticles. - Ryo Takigawa; Kohei Nitta; Akihiro Ikeda; Mitsuaki Kumazawa; Toshiharu Hirai; Michio Komatsu; Tanemasa Asano (3DIC, 2015)