Low temperature through-Si via fabrication using electroless deposition. - Fumihiro Inoue; Harold Philipsen; Alex Radisic; Silvia Armini; Peter Leunissen; Hiroshi Miyake; Ryohei Arima; Tomohiro Shimizu; Toshiaki Ito; Hirofumi Seki; Yuko Shinozaki; Tomohiko Yamamoto; et al. (3DIC, 2011)

Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. - S. Nishizawa; Ryohei Arima; Tomohiro Shimizu; Shoso Shingubara; Fumihiro Inoue (3DIC, 2013)