Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology. - Hiroyuki Ito; Hideyuki Sugita; Kenichi Okada; Tatsuya Ito; Kazuhisa Itoi; Masakazu Sato; Ryozo Yamauchi; Kazuya Masu (IEICE Trans. Electron., 2007)