Conductive adhesives for through holes and blind vias metallization. - Ryszard Kisiel; Janusz Borecki; Grazyna Koziol; Jan Felba (Microelectron. Reliab., 2005)

Problems of PCB microvias filling by conductive paste. - Ryszard Kisiel; Jan Felba; Janusz Borecki; Andrzej Moscicki (Microelectron. Reliab., 2007)

Die-attachment solutions for SiC power devices. - Ryszard Kisiel; Zbigniew Szczepanski (Microelectron. Reliab., 2009)

High-temperature properties of Schottky diodes made of silicon carbide. - Krzysztof Górecki; Damian Bisewski; Janusz Zarebski; Ryszard Kisiel; Marcin Mysliwiec (MIXDES, 2016)