Low temperature bonding for 3D interconnects. - Tadatomo Suga; Ryuichi Kondoh (3DIC, 2011)

Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. - Ryuichi Kondou; Chenxi Wang; Akitsu Shigetou; Tadatomo Suga (Microelectron. Reliab., 2012)