Enhancement of adhesion strength of Cu layer with low dielectric constant SiC: H liners in Cu interconnects. - Grace Wang; S. Balakumar; S. C. Hwee; Rakesh Kumar; T. Hara (Microelectron. J., 2005)

Improvement of the Voltage Profile and Loss Reduction in Distribution Network Using Moth Flame Algorithm: Wolaita Sodo, Ethiopia. - S. Balakumar; Akililu Getahun; Samuel Kefale; K. Ramash Kumar (J. Electr. Comput. Eng., 2021)

A High-Band Compact Microstrip Patch Antenna For 5G Wireless Technologies. - G. Santhakumar; R. Muthukumar; Asa Jyothi G; S. Balakumar; Ramya Maranan; Roshan Bonde (IC3I, 2023)

Maximum Entropy Principle Based on Bank Customer Account Validation Using the Spark Method. - Xiaorong Qiu; Ye Xu; Yingzhong Shi; S. Kannadhasan Deepa; S. Balakumar (J. Comput. Networks Commun., 2023)