Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. - Laurent Dupont 002; Zoubir Khatir; Stéphane Lefebvre; S. Bontemps (Microelectron. Reliab., 2006)

Characterisation of power modules ceramic substrates for reliability aspects. - S. Pietranico; S. Pommier; Stéphane Lefebvre; Zoubir Khatir; S. Bontemps (Microelectron. Reliab., 2009)

A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices. - S. Pietranico; Stéphane Lefebvre; S. Pommier; M. Berkani Bouaroudj; S. Bontemps (Microelectron. Reliab., 2011)