Correlation studies for component level ball impact shear test and board level drop test. - Ee-Hua Wong; Ranjan Rajoo; S. K. W. Seah; C. S. Selvanayagam; W. D. van Driel; J. F. J. M. Caers; X. J. Zhao; N. Owens; L. C. Tan; M. Leoni; P. L. Eu; Y.-S. Lai; et al. (Microelectron. Reliab., 2008)

A review of board level solder joints for mobile applications. - Ee-Hua Wong; S. K. W. Seah; V. P. W. Shim (Microelectron. Reliab., 2008)

Advances in the drop-impact reliability of solder joints for mobile applications. - Ee-Hua Wong; S. K. W. Seah; W. D. van Driel; J. F. J. M. Caers; N. Owens; Y.-S. Lai (Microelectron. Reliab., 2009)

Constitutive modeling of solder alloys for drop-impact applications. - Ee-Hua Wong; J. Chrisp; C. S. Selvanayagam; S. K. W. Seah (Microelectron. Reliab., 2016)