Characterization of crystalline MOCVD SrTiO3 films on SiO2/Si(100). - A. Sibai; S. Lhostis; Yoann Rozier; O. Salicio; S. Amtablian; C. Dubois; J. Legrand; J. P. Sénateur; M. Audier; L. Hubert-Pfalzgraff (Microelectron. Reliab., 2005)

ITAC: A complete 3D integration test platform. - Didier Lattard; Lucile Arnaud; Arnaud Garnier; Nicolas Bresson; Franck Bana; R. Segaud; Amadine Jouve; H. Jacquinot; Stéphane Moreau; Karim Azizi-Mourier; C. Chantre; Pascal Vivet; et al. (3DIC, 2016)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. - Bassel Ayoub; Stéphane Moreau; S. Lhostis; P. Lamontagne; H. Combeau; J. G. Mattei; Hélène Frémont (IRPS, 2022)

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. - Stéphane Moreau; David Bouchu; J. Jourdon; Bassel Ayoub; S. Lhostis; Hélène Frémont; P. Lamontagne (IRPS, 2023)