Impact of component placement in solder joint reliability. - T. Alander; S. Nurmi; Pekka Heino; Eero Ristolainen (Microelectron. Reliab., 2002)

The effect of solder paste composition on the reliability of SnAgCu joints. - S. Nurmi; J. Sundelin; Eero Ristolainen; T. Lepistö (Microelectron. Reliab., 2004)