Numerical prediction of failure paths at a roughened metal/polymer interface. - S. P. M. Noijen; Olaf van der Sluis; P. H. M. Timmermans; G. Q. Zhang (Microelectron. Reliab., 2009)

Prediction of the epoxy moulding compound aging effect on package reliability. - Sander Noijen; Roy Engelen; Joerg Martens; Alexandru Opran; Olaf van der Sluis; Richard B. R. van Silfhout (Microelectron. Reliab., 2010)