Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. - S. S. Deng; Jun Wei 003; Cher Ming Tan; M. L. Nai; W. B. Yu; H. Xie (Int. J. Comput. Eng. Sci., 2003)

Influence Of Applied Load On Wafer Bonding In Vacuum. - W. B. Yu; Jun Wei 003; Cher Ming Tan; S. S. Deng; M. L. Nai (Int. J. Comput. Eng. Sci., 2003)