Read disturb in flash memories: reliability case. - P. Tanduo; Luca Cola; S. Testa; M. Menchise; A. Mervic (Microelectron. Reliab., 2006)

Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism. - R. Alberti; Riccardo Enrici Vaion; A. Mervic; S. Testa (Microelectron. Reliab., 2015)