Experimental investigations and model study of moisture behaviors in polymeric materials. - X. J. Fan; S. W. Ricky Lee; Q. Han (Microelectron. Reliab., 2009)

Investigation on copper diffusion depth in copper wire bonding. - Catherine H. Chen; Shawn X. Zhang; S. W. Ricky Lee; Lebbai Mohamed (Microelectron. Reliab., 2011)

Reliability of high-power LED packaging and assembly. - Cheng-Yi Liu; S. W. Ricky Lee; Moo Whan Shin; Yi-Shao Lai (Microelectron. Reliab., 2012)

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches. - Rong Zhang 011; S. W. Ricky Lee (Microelectron. Reliab., 2012)

Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints. - Chaoran Yang; Fubin Song; S. W. Ricky Lee (Microelectron. Reliab., 2014)

Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints. - Chaoran Yang; Fuliang Le; S. W. Ricky Lee (Microelectron. Reliab., 2016)

An Integrated Capacitance-Pressure-Temperature Sensing Probe for Injection Molding Monitoring. - Wenjia Zheng; Huanjia Hu; Zheng Zhang; Weilong Ding; S. W. Ricky Lee; Furong Gao (IEEE Trans. Instrum. Meas., 2025)