8Gb 3D DDR3 DRAM using through-silicon-via technology. - Uksong Kang; Hoeju Chung; Seongmoo Heo; Soon-Hong Ahn; Hoon Lee; Sooho Cha; Jaesung Ahn; Dukmin Kwon; Jin Ho Kim; Jae-Wook Lee 007; Han-Sung Joo; Woo-Seop Kim; et al. (ISSCC, 2009)