The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies. - Maria Spyropoulou; Giannis Kanakis; Giorgos Brestas; Yuqing Jiao; Salim Abdi; Zhaowei Chen; Desalegn Wolde Feyisa; Ripalta Stabile; Nicola Calabretta; Kevin A. Williams; Virginie Nodjiadjim; Romain Hersent; et al. (OFC, 2023)

High-Precision Mapping and Analysis of Wafer-Scale Distortions in InP Membranes to Si 3D Integration. - Salim Abdi; Aleksandr Zozulia; Jeroen Bolk; E. J. Geluk; Kevin A. Williams; Yuqing Jiao (IEEE Access, 2024)