Reliability challenges for 2.5D/3D integration: An overview. - C. S. Premachandran; Seungman Choi; Salvatore Cimino; Thuy Tran-Quinn; Lloyd Burrell; Patrick Justison (IRPS, 2018)

Hot Carrier Reliability Improvement of Thicker Gate Oxide nFET Devices in Advanced FinFETs. - M. Iqbal Mahmud; Amit Gupta; Maria Toledano-Luque; N. Rao Mavilla; Jeffrey B. Johnson; P. Srinivasan 002; A. Zainuddin; S. Rao; Salvatore Cimino; Byoung Min; Tanya Nigam (IRPS, 2019)

Efficient Bidirectional protection structure for Plasma induced damage (PID) and Electrostatic discharge (ESD) for 3D IC Integration. - Premachandran CS; Salvatore Cimino; Manjunatha Prabhu (IRPS, 2020)

Optimized LDMOS Offering for Power Management and RF Applications. - Salvatore Cimino; J. Singh; Jeffrey B. Johnson; W. Zheng; Y. Chen; W. Liu; P. Srinivasan 002; O. Gonzales; M. Hauser; Matthew Koskinen; K. Nagahiro; Y. Liu; et al. (IRPS, 2022)