Strain for CMOS performance improvement. - Victor Chan; Ken Rim; Meikei Ieong; Sam Yang; Rajeev Malik; Young Way Teh; Min Yang; Qiqing Ouyang (CICC, 2005)

A Molecular Dynamics-Continuum Coupled Model for Heat Transfer in Composite Materials. - Jizu Huang; Liqun Cao; Sam Yang (Multiscale Model. Simul., 2012)

Volume element model mesh generation strategy and its application in ship thermal analysis. - Sam Yang; Emerson Dilay; Juan Carlos Ordonez; José V. C. Vargas; Julie S. Chalfant (Adv. Eng. Softw., 2015)

Mathematical formulation and demonstration of a dynamic system-level ship thermal management tool. - Sam Yang; Juan Carlos Ordonez; José V. C. Vargas; Julie S. Chalfant; Chrys Chryssostomidis (Adv. Eng. Softw., 2016)

Analog/Mixed-Signal Design Challenges in 7-nm CMOS and Beyond. - Alvin Leng Sun Loke; Da Yang 007; Tin Tin Wee; Jonathan L. Holland; Patrick Isakanian; Kern Rim; Sam Yang; Jacob S. Schneider; Giri Nallapati; Sreeker Dundigal; Hasnain Lakdawala; Behnam Amelifard; et al. (CICC, 2019)

Understanding Mobile GUI: from Pixel-Words to Screen-Sentences. - Jingwen Fu; Xiaoyi Zhang; Yuwang Wang; Wenjun Zeng 001; Sam Yang; Grayson Hilliard (CoRR, 2021)

MLPro: A System for Hosting Crowdsourced Machine Learning Challenges for Open-Ended Research Problems. - Peter Washington 001; Aayush Nandkeolyar; Sam Yang (CoRR, 2022)

Multi-fidelity power flow solver. - Sam Yang; Bjorn Vaagensmith; Deepika Patra; Ryan Hruska; Tyler Phillips 002 (CoRR, 2022)

Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering. - José V. C. Vargas; Sam Yang; Juan Carlos Ordonez; Luiz F. Rigatti; Pedro H. R. Peixoto; Wellington Balmant; Andre B. Mariano (Simul., 2022)