Extending support to customised multi-point haptic devices in CHAI3D. - Lei Wei 002; Zoran Najdovski; Hailing Zhou; Sameer Deshpande; Saeid Nahavandi (SMC, 2014)

Car park occupancy analysis using UAV images. - Hailing Zhou; Lei Wei 002; Michael Fielding; Douglas C. Creighton; Sameer Deshpande; Saeid Nahavandi (SMC, 2017)

BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond. - Gaurav Thareja; Ashish Pal; Xingye Wang; Sefa Dag; Shi You; Shashank Sharma; Qing Zhu; Carmen L. Cervantes; Shinjae Hwang; Matthew Spuller; Ben Ng; Pradeep S. Kumar; et al. (VLSI Technology and Circuits, 2023)

Characterization and Multiscale Modeling of TDDB in State-of-the-art BEOL. - Andrea Palmieri; Mahdi Tavakoli; Chi Ching; Wenkai Zheng; Shi You; Xiaodong Zhang; Davide Cornigli; Michael Haverty; Navneet Singh; Luca Larcher; Monika Jamieson; Ajay Bhatnagar; et al. (IRPS, 2024)

HaptiScan: A Haptically-Enabled Robotic Ultrasound System for Remote Medical Diagnostics. - Zoran Najdovski; Siamak Pedrammehr; Mohammad Reza Chalak Qazani; Hamid Abdi; Sameer Deshpande; Taoming Liu; James Mullins; Michael Fielding; Stephen John Hilton; Houshyar Asadi (Robotics, 2024)