Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies. - Piotr Mackowiak; Samer Al-Magazachi; Klaus-Dieter Lang; Kolja Erbacher; Manuel Bäuscher; Ha-Duong Ngo; Kai Zoschke; Michael Schiffer (DeSE, 2019)