Exploring compromises among timing, power and temperature in three-dimensional integrated circuits. - Hao Hua; Christopher Mineo; Kory Schoenfliess; Ambarish M. Sule; Samson Melamed; Ravi Jenkal; W. Rhett Davis (DAC, 2006)

Inter-die signaling in three dimensional integrated circuits. - Christopher Mineo; Ravi Jenkal; Samson Melamed; W. Rhett Davis (CICC, 2008)

Design and CAD for 3D integrated circuits. - Paul D. Franzon; W. Rhett Davis; Michael B. Steer; Steve Lipa; Eun Chu Oh; Thorlindur Thorolfsson; Samson Melamed; Sonali Luniya; Tad Doxsee; Stephen Berkeley; Ben Shani; Kurt Obermiller (DAC, 2008)

Junction-level thermal extraction and simulation of 3DICs. - Samson Melamed; Thorlindur Thorolfsson; Adi Srinivasan; Edmund Cheng; Paul D. Franzon; William Rhett Davis (3DIC, 2009)

Comparative analysis of two 3D integration implementations of a SAR processor. - Thorlindur Thorolfsson; Samson Melamed; Gary Charles; Paul D. Franzon (3DIC, 2009)

Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration. - Thorlindur Thorolfsson; Samson Melamed; W. Rhett Davis; Paul D. Franzon (ACM Trans. Design Autom. Electr. Syst., 2010)

Pathfinder 3D: A flow for system-level design space exploration. - Shivam Priyadarshi; Jianchen Hu; Won Ha Choi; Samson Melamed; Xi Chen; W. Rhett Davis; Paul D. Franzon (3DIC, 2011)

3D specific systems design and CAD. - Paul D. Franzon; W. Rhett Davis; Thorlindur Thorolfsson; Samson Melamed (ICSAMOS, 2011)

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels. - Shivam Priyadarshi; T. Robert Harris; Samson Melamed; Carlos Tadeo Ortega Otero; Nikhil Kriplani; Carlos E. Christoffersen; Rajit Manohar; Steven R. Dooley; W. Rhett Davis; Paul D. Franzon; Michael B. Steer (IET Circuits Devices Syst., 2012)

Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring. - Samson Melamed; Thorlindur Thorolfsson; T. Robert Harris; Shivam Priyadarshi; Paul D. Franzon; Michael B. Steer; W. Rhett Davis (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012)

Investigation of effects of metalization on heat spreading in bump-bonded 3D systems. - Samson Melamed; Katsuya Kikuchi; Masahiro Aoyagi (3DIC, 2015)

Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit. - Samson Melamed; Fumito Imura; Hiroshi Nakagawa; Katsuya Kikuchi; Michiya Hagimoto; Yukoh Matsumoto; Masahiro Aoyagi (Microelectron. J., 2015)

Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. - Samson Melamed; Naoya Watanabe; Shunsuke Nemoto; Haruo Shimamoto; Katsuya Kikuchi; Masahiro Aoyagi (Microelectron. Reliab., 2016)

Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. - Samson Melamed; Naoya Watanabe; Shunsuke Nemoto; Haruo Shimamoto; Katsuya Kikuchi; Masahiro Aoyagi (Microelectron. Reliab., 2017)