Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. - Minseok Ha; Samuel Graham (Microelectron. Reliab., 2012)

Electrical and structural dependence of operating temperature of AlGaN/GaN HEMTs. - Eric Heller; Sukwon Choi; Donald Dorsey; Ramakrishna Vetury; Samuel Graham (Microelectron. Reliab., 2013)

Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks. - T. Robert Harris; Eric J. Wyers; Lee Wang; Samuel Graham; Georges Pavlidis; Paul D. Franzon; W. Rhett Davis (3DIC, 2015)

Transient stress characterization of AlGaN/GaN HEMTs due to electrical and thermal effects. - Jason P. Jones; Eric Heller; Donald Dorsey; Samuel Graham (Microelectron. Reliab., 2015)

AlN-capped P-(AlxGal-x)2O3/Ga2O3 heterostructure field-effect transistors for near-junction thermal management of next generation power devices. - James Spencer Lundh; Hannah N. Masten; Kohei Sasaki; Alan G. Jacobs; Zhe Cheng; Joseph Spencer; Lei Chen; James C. Gallagher; Andrew D. Koehler; Keita Konishi; Samuel Graham; Akito Kuramata; et al. (DRC, 2022)