Partial Discharge Failure Analysis of AIN Substrates for IGBT Modules. - Jan-Henning Fabian; Samuel Hartmann; Amina Hamidi (Microelectron. Reliab., 2004)

Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 degreeC. - Lydia Feller; Samuel Hartmann; Daniel Schneider (Microelectron. Reliab., 2008)

Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts. - Emre Özkol; Samuel Hartmann; Gontran Pâques (Microelectron. Reliab., 2014)

Enhanced power cycling performance of IGBT modules with a reinforced emitter contact. - Emre Özkol; Franziska Brem; Chunlei Liu 009; Samuel Hartmann; Arnost Kopta (Microelectron. Reliab., 2015)