Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs. - Sandeep Kumar Samal; Yarui Peng; Yang Zhang; Sung Kyu Lim (ISLPED, 2013)

Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. - Sandeep Kumar Samal; Shreepad Panth; Kambiz Samadi; Mehdi Saedi; Yang Du 001; Sung Kyu Lim (DAC, 2014)

Full chip impact study of power delivery network designs in monolithic 3D ICs. - Sandeep Kumar Samal; Kambiz Samadi; Pratyush Kamal; Yang Du 001; Sung Kyu Lim (ICCAD, 2014)

Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs. - Shreepad Panth; Sandeep Kumar Samal; Yun Seop Yu; Sung Kyu Lim (J. Inform. and Commun. Convergence Engineering, 2014)

A Novel Entropy Production Based Full-Chip TSV Fatigue Analysis. - Tianchen Wang; Sandeep Kumar Samal; Sung Kyu Lim; Yiyu Shi 001 (ICCAD, 2015)

Tier partitioning strategy to mitigate BEOL degradation and cost issues in monolithic 3D ICs. - Sandeep Kumar Samal; Deepak Nayak; Motoi Ichihashi; Srinivasa Banna; Sung Kyu Lim (ICCAD, 2016)

How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions. - Sandeep Kumar Samal; Deepak Nayak; Motoi Ichihashi; Srinivasa Banna; Sung Kyu Lim (ISLPED, 2016)

Machine Learning Based Variation Modeling and Optimization for 3D ICs. - Sandeep Kumar Samal; Guoqing Chen; Sung Kyu Lim (J. Inform. and Commun. Convergence Engineering, 2016)

Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. - Sandeep Kumar Samal; Shreepad Panth; Kambiz Samadi; Mehdi Saedi; Yang Du 001; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016)

Full chip power benefits with negative capacitance FETs. - Sandeep Kumar Samal; Sourabh Khandelwal; Asif Islam Khan; Sayeef S. Salahuddin; Chenming Hu; Sung Kyu Lim (ISLPED, 2017)

Improving Performance under Process and Voltage Variations in Near-Threshold Computing Using 3D ICs. - Sandeep Kumar Samal; Guoqing Chen; Sung Kyu Lim (ACM J. Emerg. Technol. Comput. Syst., 2017)

TSV-Based 3-D ICs: Design Methods and Tools. - Tiantao Lu; Caleb Serafy; Zhiyuan Yang 001; Sandeep Kumar Samal; Sung Kyu Lim; Ankur Srivastava 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017)

Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. - Shreepad Panth; Sandeep Kumar Samal; Kambiz Samadi; Yang Du 001; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017)

Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. - Sandeep Kumar Samal; Kambiz Samadi; Pratyush Kamal; Yang Du 001; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017)

Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor. - Bon Woong Ku; Yu Liu 028; Yingyezhe Jin; Sandeep Kumar Samal; Peng Li 001; Sung Kyu Lim (DAC, 2018)

Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications. - Tianchen Wang; Sandeep Kumar Samal; Sung Kyu Lim; Yiyu Shi 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019)