Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives. - Byeung-Gee Kim; Sang-Mok Lee; Yun-Song Jo; Sun-Chul Kim; Kyoung-Moo Harr; Young-Ho Kim (Microelectron. Reliab., 2011)

FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays. - Taemin Lee; Joontaek Jung; Sang-Mok Lee; Jongcheol Park; Jae-Hyeong Park; Kyung-Wook Paik; Hyunjoo J. Lee (Sensors, 2022)

Deep-learning optimized DEOCSU suite provides an iterable pipeline for accurate ChIP-exo peak calling. - Ina Bang; Sang-Mok Lee; Seojoung Park; Joon Young Park; Linh Khanh Nong; Ye Gao; Bernhard O. Palsson; Donghyuk Kim (Briefings Bioinform., 2023)