Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. - Wenjiang Zeng; Huamao Lin; Xiaolin Zhang; Ramasamy Chockalingam; Wee Chong Heng; Sangki Hong; Narayanan Balasubramanian (Int. J. Comput. Eng. Sci., 2003)

High density backside tungsten TSV for 3D stacked ICs. - Reynard Blasa; Brian Mattis; Dave Martini; Sidi Lanee; Carl Petteway; Sangki Hong; Kangsoo Yi (3DIC, 2016)

11.4 A 512Gb 3b/cell 64-stacked WL 3D V-NAND flash memory. - Chulbum Kim; Ji-Ho Cho; Woopyo Jeong; Il-Han Park; Hyun Wook Park; Doo-Hyun Kim; Daewoon Kang; Sunghoon Lee; Ji-Sang Lee; Wontae Kim 004; Jiyoon Park; Yang-Lo Ahn; et al. (ISSCC, 2017)