CPI reliability and EMI benefit for MIM CAP embedded C4 package. - Hyunsuk Chun; In Hak Baick; Sangsu Ha; Eunmi Kwon; Seungbae Lee; Seil Kim; Sangwoo Pae; Jongwoo Park 001 (IRPS, 2015)

Systematical study of 14nm FinFET reliability: From device level stress to product HTOL. - Changze Liu; Hyun-Chul Sagong; Hyejin Kim; Seungjin Choo; Hyunwoo Lee; Yoohwan Kim; Hyunjin Kim; Bisung Jo; Minjung Jin; Jinjoo Kim; Sangsu Ha; Sangwoo Pae; et al. (IRPS, 2015)

Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC. - Jongwoo Park 001; Jungpyo Hong; Miji Lee; Dongyoon Sun; Kyung Kang; Taesung Kim; Seungwon Kim; Sujin Kwon; Changkyu Joo; Sangsu Ha; Wooyeon Kim; Jongsu Ryu; et al. (IRPS, 2015)

Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology. - Hyun-Chul Sagong; Hyunjin Kim; Seungjin Choo; Sungyoung Yoon; Hyewon Shim; Sangsu Ha; Tae-Young Jeong; Minhyeok Choe; Junekyun Park; Sangchul Shin; Sangwoo Pae (IRPS, 2018)