Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. - Stefaan Van Huylenbroeck; Yunlong Li; Michele Stucchi; Lieve Bogaerts; Joeri De Vos; Gerald Beyer; Eric Beyne; Mohand Brouri; Praveen Nalla; Sanjay Gopinath; Matthew Thorum; Joe Richardson; et al. (3DIC, 2016)

Deposition of ALD-Molybdenum for Flash Memory Wordline Metallization. - Joshua Collins; Sanjay Gopinath; Kaihan Ashtiani; Shruti Thombare; Xiaolan Ba; Griffin Kennedy; Juwen Gao (IMW, 2025)