Study of thinned Si wafer warpage in 3D stacked wafers. - Youngrae Kim; Sung-Keun Kang; Sarah Eunkyung Kim (Microelectron. Reliab., 2010)

Dynamic flow measurements of capillary underfill through a bump array in flip chip package. - Seok Hwan Lee; Jaeyong Sung; Sarah Eunkyung Kim (Microelectron. Reliab., 2010)

Evaluation of wafer level Cu bonding for 3D integration. - Sung-Geun Kang; Youngrae Kim; Eun-Sol Kim; Naeun Lim; Teakgyu Jeong; Jieun Lee; Sarah Eunkyung Kim; Sungdong Kim (3DIC, 2011)

Characterization of flip chip bonded structure with Cu ABL power bumps. - Junsung Ma; Sungdong Kim; Sarah Eunkyung Kim (Microelectron. Reliab., 2014)

Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding. - Hae-Sung Park; Han Kyeol Seo; Sarah Eunkyung Kim (3DIC, 2019)

Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application. - Han Kyeol Seo; Hae-Sung Park; Sarah Eunkyung Kim (3DIC, 2019)

First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer. - Sang Woo Park; Seul Ki Hong; Sarah Eunkyung Kim; Jong Kyung Park (IEEE Access, 2024)

Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application. - Sangwoo Park; Sangmin Lee; Junyoung Choi; Sarah Eunkyung Kim (IEEE Access, 2025)