Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. - Asisa Kumar Panigrahi; Satish Bonam; Tamal Ghosh; Siva Rama Krishna Vanjari; Shiv Govind Singh (3DIC, 2015)

Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. - Kumail Khurram; Asisa Kumar Panigrahi; Satish Bonam; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. - Asisa Kumar Panigrahi; Satish Bonam; Tamal Ghosh; Siva Rama Krishna Vanjari; Shiv Govind Singh (3DIC, 2016)

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. - Suraj Patil; Asisa Kumar Panigrahi; Satish Bonam; C. Hemanth Kumar; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Silk Piezoelectric Tactile Sensors: The Way Forward to Developing Intelligent Implantable Sensors. - Satish Bonam; Jose Joseph; Aditya Bhagavathi; Shiv Govind Singh; Siva Rama Krishna Vanjari (ISCAS, 2022)