Cooling mechanisms in 3D ICs: Thermo-mechanical perspective. - Satish G. Kandlikar; Dhireesha Kudithipudi; Carlos A. Rubio-Jimenez (IGCC, 2011)

Design Considerations for Cooling High Heat Flux IC Chips With Microchannels. - Satish G. Kandlikar (IEEE Des. Test, 2014)

Overall performance evaluation of embedded microchannel cooling layers for 3D architecture chips. - Jose-Luis Gonzalez-Hernandez; Satish G. Kandlikar (IGSC, 2015)

Co-design of 3D wireless network-on-chip architectures with microchannel-based cooling. - Md Shahriar Shamim; Amlan Ganguly; Chetan Munuswamy; Jayanti Venkataraman; Jose Hernandez; Satish G. Kandlikar (IGSC, 2015)

Evaluation of wireless network-on-chip architectures with microchannel-based cooling in 3D multicore chips. - Md Shahriar Shamim; Rounak Singh Narde; Jose-Luis Gonzalez-Hernandez; Amlan Ganguly; Jayanti Venkataraman; Satish G. Kandlikar (Sustain. Comput. Informatics Syst., 2019)