Heterogeneous Multicore SoC With SiP for Secure Multimedia Applications. - Hiroyuki Kondo; Sugako Otani; Masami Nakajima; Osamu Yamamoto; Norio Masui; Naoto Okumura; Mamoru Sakugawa; Masaya Kitao; Koichi Ishimi; Masayuki Sato; Fumitaka Fukuzawa; Satoshi Imasu; et al. (IEEE J. Solid State Circuits, 2009)

High density and reliable packaging technology with Non Conductive Film for 3D/TSV. - Kentaro Mori; Yoshihiro Ono; Shinji Watanabe 004; Toshikazu Ishikawa; Michiaki Sugiyama; Satoshi Imasu; Toshihiko Ochiai; Ryo Mori; Tsuyoshi Kida; Tomoaki Hashimoto; Hideki Tanaka; Michitaka Kimura (3DIC, 2013)