A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process. - Changsoo Jang; Seongyoung Han; Hangyu Kim; Sayoon Kang (Microelectron. Reliab., 2006)

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling. - Yoshikuni Nakadaira; Seyoung Jeong; Jongbo Shim; Jaiseok Seo; Sunhee Min; Taeje Cho; Sayoon Kang; Seyong Oh (Microelectron. Reliab., 2007)