Technologies for Rapid Prototyping of Multi-Chip Modules. - Robert F. Miracky; T. Bishop; Claire T. Galanakis; H. Hashemi; Tom J. Hirsch; S. Madere; Heinrich G. Müller; T. Rudwick; L. N. Smith; Scott C. Sommerfeldt; B. Weigler (ICCD, 1991)

Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: dependence on advanced electronic packaging to achieve full performance. - Barry K. Gilbert; Michael J. Degerstrom; Patrick J. Zabinski; Thimothy M. Schafer; Gregg J. Fokken; Barbara A. Randall; Daniel J. Schwab; Erik S. Daniel; Scott C. Sommerfeldt (Proc. IEEE, 2001)