Fabrication of TSV-based silicon interposers. - Dean Malta; Erik Vick; Scott H. Goodwin; Christopher Gregory; Matthew Lueck; Alan Huffman; Dorota Temple (3DIC, 2010)

Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration. - Jason D. Reed; Scott H. Goodwin; Christopher Gregory; Dorota Temple (3DIC, 2010)

Vias-last process technology for thick 2.5D Si interposers. - Erik Vick; Scott H. Goodwin; Garry Cunnigham; Dorota Temple (3DIC, 2011)

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test. - Dorota S. Temple; Dean Malta; Erik P. Vick; Matthew R. Lueck; Scott H. Goodwin; Mark S. Muzilla; Christopher M. Masterjohn; Mark R. Skokan (3DIC, 2014)

Innovative practices on design & test for flexible hybrid electronics. - Tsung-Ching Jim Huang; Jason Marsh; Scott H. Goodwin; Dorota S. Temple (VTS, 2018)