A moisture-related breakdown mechanism in low-k dielectrics using a multiple I-V ramp test. - Sean P. Ogden; Juan Borja; Huawei Zhou; Joel L. Plawsky; Toh-Ming Lu; William N. Gill (IRPS, 2015)

Effect of metal line width on electromigration of BEOL Cu interconnects. - Seungman Choi; Cathryn Christiansen; Linjun Cao; James Zhang; Ronald Filippi; Tian Shen; Kong Boon Yeap; Sean P. Ogden; Haojun Zhang; Bianzhu Fu; Patrick Justison (IRPS, 2018)

New insight on TDDB area scaling methodology of non-Poisson systems. - Tian Shen; Kong Boon Yeap; Sean P. Ogden; Cathryn Christiansen; Patrick Justison (IRPS, 2018)

Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. - Sean P. Ogden; Yueming Xu; Kong Boon Yeap; Tian Shen; Toh-Ming Lu; Joel L. Plawsky (Microelectron. Reliab., 2018)

Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime. - Lili Cheng; Seungman Choi; Sean P. Ogden; Teck Jung Tang; Robert Fox (IRPS, 2019)