Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy. - Sebastian Brand 001; P. Czurratis; P. Hoffrogge; Matthias Petzold (Microelectron. Reliab., 2010)

Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices. - Günther Vogg; T. Heidmann; Sebastian Brand 001 (Microelectron. Reliab., 2015)

Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy. - Sebastian Brand 001; Michél Simon-Najasek; Michael Kögel; Joerg Jatzkowski; R. Portius; Frank Altmann (Microelectron. Reliab., 2016)

Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis. - Ahmad Khaled; Sebastian Brand 001; Michael Kögel; Tim Appenroth; Ingrid De Wolf (Microelectron. Reliab., 2016)

Magnetic field and current density imaging using off-line lock-in analysis. - Michael Kögel; Frank Altmann; Sebastian Tismer; Sebastian Brand 001 (Microelectron. Reliab., 2016)

Study of GHz-SAM sensitivity to delamination in BEOL layers. - Ahmad Khaled; Luka Kljucar; Sebastian Brand 001; Michael Kögel; Robert Aertgeerts; Ruben Nicasy; Ingrid De Wolf (Microelectron. Reliab., 2017)

Enhanced non-contact ultrasonic testing using an air-coupled optical microphone. - Georg Kaniak; Wolfgang Rohringer; Matthias Brauns; Nils Panzer; Fabian Lücking; Balthasar Fischer; Sebastian Brand 001; Christian Große (IEEE SENSORS, 2020)

Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR). - Michael Kögel; Sebastian Brand 001; Christian Große; Kristof J. P. Jacobs; Ingrid De Wolf; Frank Altmann (CASE, 2021)