Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments. - Sébastien Gallois-Garreignot; Vincent Fiori; D. Nelias (Microelectron. Reliab., 2010)

Thermal correlation between measurements and FEM simulations in 3D ICs. - Papa Momar Souare; François de Crecy; Vincent Fiori; M. Haykel Ben Jamaa; Alexis Farcy; Sébastien Gallois-Garreignot; Andras Borbely; Jean-Philippe Colonna; Perceval Coudrain; B. Giraud; C. Laviron; Séverine Cheramy; et al. (3DIC, 2013)

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sebastien Petitdidier; Norbert Chevrier; Sébastien Gallois-Garreignot; Alexis Farcy; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (3DIC, 2013)

Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. - Vincent Fiori; Sébastien Gallois-Garreignot; Hervé Jaouen; Clément Tavernier (Microelectron. Reliab., 2013)

Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. - Vincent Fiori; Komi-Atchou Ewuame; Sébastien Gallois-Garreignot; Hervé Jaouen; Clément Tavernier (Microelectron. Reliab., 2014)

Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. - Sébastien Gallois-Garreignot; Naceur Benzima; Etienne Benmussa; Caroline Moutin; Pierre-Olivier Bouchard; Vincent Fiori; Clément Tavernier (Microelectron. Reliab., 2015)

Thermo-mechanical characterization of passive stress sensors in Si interposer. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sébastien Gallois-Garreignot; Komi-Atchou Ewuame; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (Microelectron. Reliab., 2015)

Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. - Thomas Wlanis; René Hammer; Werner Ecker; Sandrine Lhostis; Clément Sart; Sébastien Gallois-Garreignot; Bernhard Rebhan; Günther A. Maier (Microelectron. Reliab., 2018)

Investigation Into the Moisture Degradation Mechanism of Integrated Stacks Using New Moisture Sensor Design. - B. Ayoub; G. Imbert; F. Belfis; T. Parrassin; Sébastien Gallois-Garreignot; L. Mischler; Geneviève Duchamp; Hélène Frémont (IRPS, 2025)