Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications. - Abdellah Salahouelhadj; Marion Martiny; Sebastien Mercier; Laurent Bodin; David Manteigas; B. Stephan (Microelectron. Reliab., 2014)

Thermo-mechanical simulation of PCB with embedded components. - Wiyao Kpobie; Marion Martiny; Sebastien Mercier; François Lechleiter; Laurent Bodin; Aurélien Lecavelier des Etangs-Levallois; M. Brizoux (Microelectron. Reliab., 2016)