3D integration demonstration of a wireless product with design partitioning. - G. Druais; Pascal Ancey; C. Aumont; V. Caubet; Laurent-Luc Chapelon; C. Chaton; Séverine Cheramy; S. Cordova; E. Cirot; Jean-Philippe Colonna; Perceval Coudrain; T. Divel; et al. (3DIC, 2011)

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sebastien Petitdidier; Norbert Chevrier; Sébastien Gallois-Garreignot; Alexis Farcy; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (3DIC, 2013)