Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC. - Won-Myoung Ki; Myong-Suk Kang; Sehoon Yoo; Chang-Woo Lee (3DIC, 2011)

Advanced TSV filling method with Sn alloy and its reliability. - Young-Ki Ko; Myong-Suk Kang; Hiroyuki Kokawa; Yutaka S. Sato; Sehoon Yoo; Chang-Woo Lee (3DIC, 2011)

Multi-function unit for LED lighting. - Sehoon Yoo; Sehyun Song; Kichul Kim; Chanwoo Park; Jungchul Gong (ISOCC, 2012)

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications. - Byung-Suk Lee; Yong-Ho Ko; Jung-Hwan Bang; Chang-Woo Lee; Sehoon Yoo; Jun-Ki Kim; Jeong-Won Yoon (Microelectron. Reliab., 2017)

A 1280×960 Dynamic Vision Sensor with a 4.95-μm Pixel Pitch and Motion Artifact Minimization. - Yunjae Suh; Seungnam Choi; Masamichi Ito; Jeongseok Kim; Youngho Lee; Jongseok Seo; Heejae Jung; Dong-Hee Yeo; Seol Namgung; Jongwoo Bong; Sehoon Yoo; Seung-Hun Shin; et al. (ISCAS, 2020)

Advanced novel optical stack technologies for high SNR in CMOS Image Sensor. - Hye Yeon Park; Yunki Lee; Jonghoon Park; Hyunseok Song; Taesung Lee; Hyung Keun Gweon; Yunji Jung; Jeongmin Bae 004; Boseong Kim; Junwon Han; Seungwon Kim; Cheolsang Yoon; et al. (VLSI Technology and Circuits, 2022)