Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation. - Yusuf Cinar; Jinwoo Jang; Gunhee Jang; Seonsik Kim; Jaeseok Jang; Jinkyu Chang; Yonghyun Jun (Microelectron. Reliab., 2012)

Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique. - Yusuf Cinar; Jinwoo Jang; Gunhee Jang; Seonsik Kim; Jaeseok Jang (Microelectron. Reliab., 2013)