A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization. - François Le Henaff; Stephane Azzopardi; Jean-Yves Delétage; Eric Woirgard; Serge Bontemps; Julien Joguet (Microelectron. Reliab., 2012)

Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering. - Maxime Barrière; Alexandrine Guédon-Gracia; Eric Woirgard; Serge Bontemps; François Le Henaff (Microelectron. Reliab., 2017)